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Great lessons from the back of the envelope

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TitleGreat lessons from the back of the envelope
Publication TypeJournal Article
Year of Publication2014
AuthorsBevilacqua, A
JournalIEEE Solid-State Circuits Magazine
Volume6
Pagination45-45
Date PublishedSummer
ISSN1943-0582
KeywordsEducational institutions, Engineering profession, Laboratories, Microelectronics, MIMICs
DOI10.1109/MSSC.2014.2327711
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