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B

A. Bevilacqua, “Great lessons from the back of the envelope”, IEEE Solid-State Circuits Magazine, vol. 6, pp. 45-45, 2014.

C

F. Chiocchetta, De Santi, C., Rampazzo, F., Mukherjee, K., Grünenpütt, J., Sommer, D., Blanck, H., Lambert, B., Gerosa, A., MENEGHESSO, G., Zanoni, E., and Meneghini, M., “GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse”, in 2022 IEEE International Reliability Physics Symposium (IRPS), 2022.

M

G. Marin, Cherniak, K., Subotskaya, V., Bodano, E., Sandner, C., and Bevilacqua, A., “Global Optimization of Reconfigurable Switched Capacitor DC-DC Converters”, in 2019 26th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2019.

S

C. Shi, Song, M., Gao, Z., Bevilacqua, A., Dolmans, G., and Liu, Y. - H., “Galvanic-Coupled Trans-Dural Data Transfer for High-Bandwidth Intracortical Neural Sensing”, IEEE Transactions on Microwave Theory and Techniques, vol. 70, pp. 4579-4589, 2022.